Elma now offers ATR solutions with a Liquid Heat Exchange (LHE) cooling design.   Standard conduction-cooled cards can be plugged into the chassis.   The heat from the cards is transferred to the sidewalls, where the liquid is pumped through, dissipating large levels of heat.  This design helps cool up to 150W/slot.  This is particularly important as many designs move to higher wattage VXS and VPX architectures.  The LHE format is much simpler and more cost-effective liquid cooling method.  With the liquid going through the sidewalls versus directly through the cards, the setup is vastly less complicated and less risky.  The independent dual wall construction provides redundancy is if one side of the chassis is damaged and the walls are Line Replaceable Units out in the field.  

The high integrity frame of the ATR is typically 25% -30% lighter than alternative dip-braised designs and it enables application-specific changes to be readily implemented without compromising thermal efficiency or structural strength.

Three plumbing versions using different materials, protective coatings and connectors are available.  This enables seawater, aviation fuel or CFCs, ammonia or various alcohols to be used as the cooling fluid to suit the application.  Elma also employs drip-less quick disconnects that are bone-dry when unplugged even with the liquid pump still running. 

For more information on Elma’s liquid-cooled enclosure solutions, visit www.elma.com or contact us at sales@elma.com