VIA launches stackable multi-story chassis for VIA embedded boards. 

The VIA AMOS-1000 Mini-ITX Chassis

  • A universal compact embedded chassis supporting Mini-ITX embedded boards
  • Additional sub-system chassis for riser cards (PCI, PCIe) and storage (2nd or 3rd HDD, slim ODD, CF, DOM) expansion
  • Ready for comprehensive I/O expansion, including:
    • Removable front I/O panel
    • Reserved cutouts for various I/O ports on rear I/O panel
    • Reserved space for mounting LOC-01, LPC-02, PUSB-01, and WLAN modules
  • Co-mechanical design for either 120W DC power board (default) or 1U AC ATX PSU (optional)
  • WiFi networking options
  • Multiple mounting solutions: Wall / Table mountable
  • Compatible sub-system chassis: Storage chassis module, Riser chassis module

The VIA AMOS-2000 Nano-ITX Chassis

  • A universal compact embedded chassis supporting Nano-ITX embedded boards
  • Additional expansion subsystem chassis with storage (2nd HDD / slim ODD / CF / DOM) chassis
  • Ready for comprehensive I/O expansion, including:
    • Removable front I/O panel
    • Reserved cutouts for various I/O ports on rear I/O panel
    • Reserved Space for mounting the LPC-02, WLAN module
  • Bottom plate opening for various CF / Mini PCI sockets
  • WiFi networking options
  • Multiple mounting solutions: Wall / Table / VESA mountable
  • Compatible sub-system chassis: Storage chassis module: VIA AMOS-2501

The VIA AMOS-5000 Em-ITX Chassis

The VIA AMOS-5000 modular chassis kit is designed to take advantage of boards based on the VIA-developed Em-ITX form factor, making it easy to create a range of highly versatile, fanless, rugged and easy to assemble IPC design for a range of embedded applications.

The VIA AMOS-5000 chassis kit takes advantage of the unique features that Em-ITX brings to the embedded market, including a rich I/O feature set along both sides of the board through unique dual I/O coastlines, an EMIO bus which uses both legacy and modern bus technologies to work with a range of Em-ITX expansion modules in a variety of application specific I/O configurations.

Systems built using the VIA AMOS-5000 chassis kit are completely fanless and withstand a wide temperature range of -20°c to 55°c . Capable of sustaining a g-force of up to 50, VIA AMOS-5000 chassis are easily assembled and maintained, using only five mechanical pieces to form a robust, fanless system with extensive I/O options.

  • Fanless operation from -20°C up to 55°C
  • Easy, quick installation and maintenance with only five parts
  • Shock resistant up to 50G with vibration resistant design to ensure extended reliability
  • Modularized design with compact dimensions: 232mm(W) x 53mm(H) x 126mm(D)
  • Easy to use inter-changeable and customizable front and rear panels
  • Built-in common I/O functional feature cutouts for easy external access
  • Maximum space efficiency for optimized electromagnetic compatibility

 

VIA Technologies, Inc., USA
940 Mission Court
F
remont, CA 94539 USA
Tel: 1-510-683 3300
Fax:1-510-6874654
E-mail: embedded@viatech.com